The partnership introduces a cutting-edge sustainable innovation to launch a large-scale market for near-field communication (NFC) connectivity with low carbon emissions.
– The new product lines Tageos “EOS Lite” and “EOS Zero Lite” are specially designed solutions to minimize carbon footprint through innovative antenna designs, ultra-thin FlexIC (flexible integrated circuit) technology from Pragmatic Semiconductor, and sustainable manufacturing processes. – The EOS-932 Zero Lite PR1301 is a durable NFC communication inlay based on paper and the first product in this new range of inlays and tags. – The EOS Lite and EOS Zero Lite ranges utilize the latest RFID technology with the Pragmatic NFC Connect PR1301 chip to significantly reduce materials, carbon footprint, and costs.
Montpellier, France, and Cambridge, England, April 16, 2026 /PRNewswire/ — Tageos, a global leader in RFID and BLE inlays, and Pragmatic Semiconductor, a pioneer in flexible semiconductor technology, announce the extension of their long-term strategic partnership with the launch of a brand-new range of Tageos products based on Pragmatic’s flexible and durable NFC Connect products. The new EOS Lite and EOS Zero Lite product lines from Tageos offer innovative antenna designs with thin profiles and low carbon emissions, meeting the increasing demand for object-level intelligence and new business opportunities linking our physical and digital worlds.
The EOS-932 Zero Lite PR1301 is a cost-effective and durable NFC inlay on paper, designed for seamless integration into paper packaging and labels. It enables various mass applications, such as consumer engagement and product authentication, where durability, form factor, and digital connectivity are essential. The combination of the ultra-thin Pragmatic NFC Connect chip and a paper inlay antenna allows for easy integration for mass production, cost-effective deployment, and improved recyclability of paper in retail packaging and labels.
Developed by the Innovation Center of Excellence (ICoE) at Tageos, these new products benefit from the company’s expertise in durable RFID inlays and tags and are the first to integrate Pragmatic’s NFC Connect PR1301 chip. Thanks to its ultra-thin and flexible design, the chip is imperceptible to the touch, allowing discreet integration on curved surfaces, packaging, or inside products, enabling large-scale object intelligence in traditionally cost-constrained areas, supply chains, and sustainability challenges.
By enabling an extendable digital identity of the product and interaction with the consumer’s smartphone, the new inlay supports the emerging physical-digital integration, recycling in current retail supply chains, and digitization of the customer experience. Brands and retailers can now discreetly integrate NFC features into packaging without altering appearance, reduce their overall carbon footprint, and transform products into powerful marketing channels for consumer engagement, product authentication, and brand protection.
“Our close collaboration with Pragmatic Semiconductor allows us to marry innovation with a clear vision of sustainability, enabling customers to deliver highly scalable, cost-effective, truly sustainable NFC inlays for smart packaging applications,” said Matthieu Picon, CEO of Tageos. “The dynamic new product lines EOS Lite and EOS Zero Lite, based on FlexIC technology, are another example of our success, offering brands new ways to connect with customers through their products and the consumer’s most personal device, the smartphone.”
“The commercialization of this innovation is an exciting deployment of our FlexIC technology. With Tageos, we seize the rapidly expanding opportunity to seamlessly integrate object-level intelligence and deliver durable, connected experiences on a large scale,” said David Moore, CEO of Pragmatic Semiconductor. “Together, we are ushering in a new era of smarter packaging, allowing direct consumer engagement with virtually any item to prove authenticity, foster trust, and access data-driven insights and transparency throughout the value chain.”
Prototype samples of EOS-932 Zero Lite PR1301 will be available on request by the end of the second quarter. Another series of new accompanying products will be introduced throughout the year. Volume orders are expected to be available from the third quarter of 2026.
About Tageos
Tageos is a global leader in designing and manufacturing RFID and wireless IoT inlays and tags. The company offers a complete portfolio of innovative and high-quality products and sensors (RAIN RFID/UHF, NFC/HF, BLE), enabling end customers such as retailers, brand owners, and industrial manufacturers to identify, authenticate, track, and trace a wide range of products and assets. Tageos is ISO 9001:2015 and ISO 14001:2015 certified and holds the ARC quality certification from Auburn University’s RFID Lab. Headquartered in Montpellier, France, Tageos has production sites and offices in France, the United States, China, Germany, Hong Kong (SAR), India, Italy, and Mexico. Tageos has been part of the Fedrigoni group since 2022.
For more information, visit www.tageos.com.
About Pragmatic Semiconductor
Pragmatic Semiconductor is a pioneer in flexible semiconductor technology at scale to bridge the sustainable gap between the digital and physical worlds. Pragmatic designs and manufactures flexible integrated circuits (FlexICs) – ultra-thin and flexible semiconductors.
Pragmatic’s products, FlexIC platforms, and foundry services enable customers to deliver flexible innovation with connection, sensing, and computational capabilities, enabling sustainable object-level intelligence at scale and speed. The Pragmatic FlexIC foundry leverages a unique and innovative process offering sustainable production and rapid innovation cycles, as well as a path to supply chain resilience.
For more information, visit www.pragmaticsemi.com.
